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Resist Coating Uniformity & Defect Monitoring

Perfect the Coat. Eliminate Contamination. Ensure Photolithography Precision.

RESIST COATING UNIFORMITY & DEFECT MONITORING

CONSISTENT COATING ISN’T OPTIONAL. IT’S LITHOGRAPHY’S FOUNDATION.

RESIST COATING UNIFORMITY & DEFECT MONITORING 2

Photoresist coating is the first critical step in wafer patterning, any variation in film thickness, streaks, or contamination can cause pattern distortion or complete lithography failure. Yet, traditional inline checks or manual inspections often miss these subtle but fatal errors.

AI-powered Resist Coating Uniformity & Defect Monitoring uses computer vision to continuously inspect resist film application in real-time. It tracks film consistency, detects defects like bubbles, streaks, and particles, and identifies non-uniform thickness across the wafer, before the wafer reaches the exposure tool.

OUR HOLISTIC VIEW TO CHALLENGES & FEATURES

Challenges

Non-Uniform Film Thickness

Non-Uniform Film Thickness

Variations across wafer radius or from batch-to-batch can result in uneven exposure or resist development.

Surface Defects Go Undetected

Surface Defects Go Undetected

Bubbles, streaks, or particles are difficult to catch without consistent high-resolution inspection.

Resist Degradation or Edge Bead Issues

Resist Degradation or Edge Bead Issues

Poor edge bead removal (EBR) or aging resist causes contamination at the wafer edge, reducing usable area.

Delayed Detection in Downstream Lithography

Delayed Detection in Downstream Lithography

Defects are often discovered only after exposure or development, too late for correction.

Features

Real-Time Resist Coating Inspection

Real-Time Resist Coating Inspection

High-speed cameras scan coated wafers for surface anomalies and coating consistency before exposure.

AI-Based Thickness Uniformity Mapping

AI-Based Thickness Uniformity Mapping

Visual data is processed to detect microns of variation across wafer zones and flag abnormal patterns.

Edge Bead and Bubble Detection

Edge Bead and Bubble Detection

Identifies EBR failures, air bubble entrapments, and inconsistent spin profiles that can compromise quality.

Auto-Flag for Re-Coating or Hold

Auto-Flag for Re-Coating or Hold

Automatically stops defective wafers from progressing and recommends rework, saving exposure tool cycles.

WHO BENEFITS FROM RESIST COATING INSPECTION?

RESIST COATING UNIFORMITY & DEFECT MONITORING 3
  • Lithography Engineers – Maintain coating precision for advanced node photolithography.
  • Cleanroom Operators – Catch edge or center coating anomalies before exposure.
  • Yield Managers – Prevent rework and defect propagation caused by invisible resist coating failures.
  • Tool Maintenance Teams – Detect nozzle or dispense issues without relying on periodic manual test wafers.

BUILDING AND DEPLOYING PROCESS

RESIST COATING UNIFORMITY & DEFECT MONITORING 4
Coating Tool Integration Planning

Coating Tool Integration Planning

We begin by identifying the optimal inspection point, typically between the spin coater and EBR or before bake, to ensure full visual access before exposure.

Visual Calibration for Multiple Coating Recipes

Visual Calibration for Multiple Coating Recipes

Camera and lighting systems are tuned to work across multiple resist chemistries and coating speeds, with configurable profiles for each product line.

AI Model Training on Surface Anomalies

AI Model Training on Surface Anomalies

Our models are trained using historical coated wafer data, including edge bead patterns, film breaks, nozzle defects, and particulate contamination.

Real-Time Rework Trigger & Data Logging

Real-Time Rework Trigger & Data Logging

The inspection system sends “pass,” “hold,” or “re-coat” commands directly to your MES system, while simultaneously logging heatmaps and coating stats per wafer ID for traceability.

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